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Applied Materials Panel-level Advanced Packaging Process Engineer (PVD)

Applied Materials Panel-level Advanced Packaging Process Engineer (PVD) — Hwaseong-Lucestar,KOR · Full time. 담당 업무·지원 자격·마감일과 공식 지원 링크를 확인하세요.

진행·예정 · 출처에서 확인한 정보이며 최종 조건은 공식 원문을 확인하세요.

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Applied Materials Panel-level Advanced Packaging Process Engineer (PVD) — Applied Materials · Hwaseong-Lucestar,KOR · Full time. 현재 상태: 진행·예정.

정보 갱신일 2026-10-21

Provide on‑site technical support for Applied Materials PVD metal deposition systems on panel‑level platforms, including installation, qualification, troubleshooting, and long‑term process stabilization.
Support, maintain, and optimize PVD metallization processes including seed, barrier, and RDL-related metal stack deposition for panel-level packaging applications.
Design and execute process development activities and DOEs, analyze data using statistical methodologies, and provide technical recommendations for process optimization.
Diagnose and resolve complex process and equipment issues on large‑format panel substrates using structured root cause analysis methodologies.
Address panel‑specific challenges such as film uniformity across large panel areas, panel warpage/handling, and edge‑to‑center metal profile control.
Collaborate closely with customers, field teams, and internal engineering groups to achieve technical and operational objectives.
Leverage best practices and proven solutions to deliver practical and innovative process improvements.
Serve as a technical resource and mentor for junior engineers and support small to mid‑scale projects as assigned.

Master's or Bachelor's degree in Materials Science, Chemistry, Semiconductor Engineering, or a related technical discipline.
3–10 years of experience in semiconductor process engineering, equipment support, or advanced packaging environments.
Strong sense of ownership, attention to detail, and ability to work in physically demanding fab environments.
Excellent communication and interpersonal skills for customer‑facing technical support.
Proficiency in English for technical documentation and global collaboration.
Willingness to work at and travel between the Cheonan and Dongtan sites as required.

Master's or Bachelor's degree in a relevant engineering field.
Hands‑on experience with PVD metallization (seed, barrier, and metal‑stack deposition).
Knowledge of advanced packaging technologies including FOPLP, chiplet integration, and heterogeneous packaging.
Understanding of process integration challenges in large-format panel PVD processing equipment and related metallization technologies.
Experience supporting advanced packaging and metallization processes in both wafer-level and panel-level manufacturing environments.
Prior on‑site customer support or field engineering experience.
General understanding of back‑end‑of‑line (BEOL) and panel‑level packaging process flows, including RDL metallization.
Work directly with leading global semiconductor manufacturers on cutting‑edge panel‑level advanced packaging technologies.
High‑impact, customer‑facing role with strong technical ownership and visibility.
Opportunity to grow into a subject-matter expert in panel-level packaging, metallization, and PVD process technologies.
Collaborative, technology‑driven, and innovation‑focused work environment.