딥엑스 [HW] High-Speed Interface SI/PI Engineer

한 줄 요약

딥엑스 [HW] High-Speed Interface SI/PI Engineer — 딥엑스 · ㈜딥엑스 · 경력 3~30년 · 정규직. 현재 상태: 진행·예정.

정보 갱신일 2026-10-21

조건·일정 확인

기관·대학

딥엑스

지역·근무지

㈜딥엑스

고용 형태

정규직

경력

경력 3~30년

학력

석사 이상

담당 업무

• □ PDN & Power Integrity Analysis: Perform comprehensive PDN analysis including DC/AC frequency-domain analysis (Target Impedance profiling) and time-domain transient simulations to guarantee stable power delivery from the VRM to the die.
• □ NPU Transient Power Management: Analyze and mitigate inrush current and severe $di/dt$ noise caused by the simultaneous switching of massive digital blocks (e.g., MAC arrays) in NPU architectures. Establish and optimize on-die, package, and board-level decoupling capacitor (Decap) strategies to prevent Dynamic Voltage Drop (DVD) and Ground Bounce.
• □ SI Modeling & Simulation: Perform comprehensive Signal Integrity (SI) simulations for high-speed interfaces (LPDDR4/5, PCIe Gen4/5, MIPI, etc.), ensuring optimal eye diagrams and jitter margins.
• □ System-Level Co-Simulation: Conduct Chip-Package-Board (CPB) co-simulations using CPM (Chip Power Model) or equivalent methodologies to evaluate and mitigate cross-talk, EMI/EMC issues, thermal-electrical coupling, and IR drop.
• □ Design Optimization: Establish design guides for PCB/Package stack-ups, high-speed routing, and optimal Decap placement (using optimization tools) to meet strict noise and jitter budgets.
• □ Validation & Correlation: Collaborate with the hardware team to perform lab measurements (using Oscilloscopes, VNA, TDR, and active probes) and correlate physical data with simulation results.

우대 사항

• □ Master’s or Ph.D. with a focus on Electromagnetics, Power Electronics, or High-Speed Circuit Design.
• □ NPU/GPU Power Design: Direct experience resolving extreme transient power challenges in highly parallel computing architectures like NPUs, GPUs, or high-end SoCs.
• □ Specific Protocol Expertise: Experience with LPDDR5x or PCIe Gen5/6 interface design and verification.
• □ Packaging Knowledge: Understanding of advanced packaging technologies (Flip-chip, 2.5D/3D IC, SiP) and their impact on signal and power integrity.
• □ Scripting Skills: Proficiency in Python or MATLAB for automation of simulation workflows and data post-processing.
• □ Communication: Strong problem-solving skills and the ability to communicate technical concepts clearly across multi-functional teams (SoC Design, Package, and System).

공식 출처와 다음 단계

원천 정보 갱신: 2026. 10. 21. PM 5:06

본문에 없는 자격·금액·일정은 임의로 보완하지 않습니다. 원문과 담당 기관에서 확인하세요.

관련 정보

딥엑스 연구·기술직 채용 · 연구·기술직 채용공고 전체 보기